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Failure Analyses


​We use diverse failure analysis methods to investigate failures in electrical and electronic devices, and the causes of the failures.

The purpose of failure analyses is to find the root causes of the failures

Failure analyses are used for a multitude of purposes (for example, process development, improvement of reliability, accident investigation). Failure analysis is also an essential part of accelerated tests when the service life or failure rate of a product is evaluated. Regardless of the purpose, finding the root cause of failure often provides the opportunity of drawing up instructions for avoiding similar failures in the future.

The causes of failures in electronic products are complex and can be connected to several different factors, such as design, manufacturing or use of the product. For this reason, it is also important to examine the background information of the faulty device together with the client before starting the actual technical part of the process.

The methods and equipment we use in our failure analyses include the following

  • Visual inspection, optical microscopy
  • Electrical measurements
  • Mechanical opening of components
  • Micro sections
  • X-ray spectrometry (XRF, XRD)
  • Infrared spectrometry (FTIR)


We also offer comprehensive third-party reporting for dispute resolution.


Corrosion in the leads of a microchip

See also:


Tel.+358 20 722 7070
Fax+358 20 722 7001

Opening hours 9:00 - 11:00 and 12:00 - 15:00, GMT +2 time zone




P.O. Box 47, FI-02151 Espoo, Finland
Tel. exchange +358 20 722 111
Opening hours Mon - Fri 8:00 - 16:30,
GMT +2 time zone
Fax +358 20 722 7001
Contact us

Tel. +358 20 722 7070
Fax +358 20 722 7001
Opening hours 9:00 - 11:00 and
12:00 - 15:00,
GMT +2 time zone